Cypress Semiconductor STK16C88 Manual do Utilizador descarregar pdf (Página 26)

12.02.07

Simtek Confidential

nvSRAM vs Battery Backed SRAMs

More difficult to manufacture due to:

•

Can’t flow solder directly. Requires

two solder flows

•

Requires a socket for single solder

flow process

•

Yield loss due to insertion process

•

Requires hand insertion into the

socket, requiring a secondary step just

to deal with the battery

•

Even with snaphat package, this

requires a secondary step for addition

of the battery.

•

More inventory of components

•

Need to track shelf life of battery

•

Batteries have hazardous waste

material

•

No specialized write procedures, easy

on F/W

BBSRAMs

Higher manufacturing yield and capacity due

to:

•

Single solder flow assembly.

•

No insertion or secondary steps

•

No hand or manual placement

Manufacturing

•

No hazardous materialROHS

•

No specialized write procedures, easy on

F/W

•

No need to gauge battery life and develop

scheme for data recovery after power loss

Hardware and

firmware

design

Category nvSRAMs

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