Cypress Semiconductor CY7C1364C Manual do Utilizador Página 5

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CY7C1364C
Document Number: 001-74592 Rev. *B Page 5 of 29
Pin Definitions
Name I/O Description
A
0
, A
1
, A Input-
Synchronous
Address Inputs used to select one of the 256K address locations. Sampled at the rising edge of the
CLK if ADSP
or ADSC is active LOW, and CE
1
, CE
2
, and CE
3
are sampled active. A
[1:0]
feed the 2-bit
counter.
BW
A
, BW
B
,
BW
C
, BW
D
Input-
Synchronous
Byte Write Select Inputs, active LOW. Qualified with BWE to conduct byte writes to the SRAM. Sampled
on the rising edge of CLK.
GW Input-
Synchronous
Global Write Enable Input, active LOW. When asserted LOW on the rising edge of CLK, a global Write
is conducted (ALL bytes are written, regardless of the values on BW
[A:D]
and BWE).
BWE
Input-
Synchronous
Byte Write Enable Input, active LOW. Sampled on the rising edge of CLK. This signal must be asserted
LOW to conduct a Byte Write.
CLK Input-
Clock
Clock Input. Used to capture all synchronous inputs to the device. Also used to increment the burst
counter when ADV
is asserted LOW, during a burst operation.
CE
1
Input-
Synchronous
Chip Enable 1 Input, active LOW. Sampled on the rising edge of CLK. Used in conjunction with CE
2
and CE
3
to select/deselect the device. ADSP is ignored if CE
1
is HIGH. CE
1
is sampled only when a new
external address is loaded.
CE
2
Input-
Synchronous
Chip Enable 2 Input, active HIGH. Sampled on the rising edge of CLK. Used in conjunction with
CE
1
and
CE
3
to select/deselect the device. CE
2
is sampled only when a new external address is loaded.
CE
3
Input-
Synchronous
Chip Enable 3 Input, active LOW. Sampled on the rising edge of CLK. Used in conjunction with CE
1
and
CE
2
to select/deselect the device.CE
3
is assumed active throughout this document for BGA. CE
3
is
sampled only when a new external address is loaded.
OE
Input-
Asynchronous
Output Enable, asynchronous input, active LOW. Controls the direction of the I/O pins. When LOW,
the I/O pins behave as outputs. When deasserted HIGH, I/O pins are tri-stated, and act as input data
pins. OE
is masked during the first clock of a Read cycle when emerging from a deselected state.
ADV
Input-
Synchronous
Advance Input signal, sampled on the rising edge of CLK, active LOW. When asserted, it
automatically increments the address in a burst cycle.
ADSP
Input-
Synchronous
Address Strobe from Processor, sampled on the rising edge of CLK, active LOW. When asserted
LOW, A is captured in the address registers. A
[1:0]
are also loaded into the burst counter. When
ADSP
and ADSC are both asserted, only ADSP is recognized. ASDP is ignored when CE
1
is deasserted HIGH.
ADSC
Input-
Synchronous
Address Strobe from Controller, sampled on the rising edge of CLK, active LOW. When asserted
LOW, A is captured in the address registers. A
[1:0]
are also loaded into the burst counter. When ADSP
and ADSC are both asserted, only ADSP is recognized.
ZZ Input-
Asynchronous
ZZ “sleep” Input, active HIGH. This input, when High places the device in a non-time-critical “sleep
condition with data integrity preserved. For normal operation, this pin has to be LOW or left floating. ZZ
pin has an internal pull-down.
DQs I/O-
Synchronous
Bidirectional Data I/O lines. As inputs, they feed into an on-chip data register that is triggered by the
rising edge of CLK. As outputs, they deliver the data contained in the memory location specified by “A”
during the previous clock rise of the Read cycle. The direction of the pins is controlled by OE. When OE
is asserted LOW, the pins behave as outputs. When HIGH, DQ are placed in a tri-state condition.
V
DD
Power Supply Power supply inputs to the core of the device.
V
SS
Ground Ground for the core of the device.
V
DDQ
I/O Power
Supply
Power supply for the I/O circuitry.
V
SSQ
I/O Ground Ground for the I/O circuitry.
MODE Input-
Static
Selects Burst Order. When tied to GND selects linear burst sequence. When tied to V
DD
or left floating
selects interleaved burst sequence. This is a strap pin and should remain static during device operation.
Mode pin has an internal pull-up.
TDO JTAG serial
output
synchronous
Serial data-out to the JTAG circuit. Delivers data on the negative edge of TCK. If the JTAG feature is
not being used, this pin should be disconnected.
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