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36-Mbit QDR™-II SRAM 4-Word
Burst Architecture
CY7C1411JV18, CY7C1426JV18
CY7C1413JV18, CY7C1415JV18
Cypress Semiconductor Corporation 198 Champion Court San Jose, CA 95134-1709 408-943-2600
Document Number: 001-12557 Rev. *C Revised June 25, 2008
Features
Separate independent read and write data ports
Supports concurrent transactions
300 MHz clock for high bandwidth
4-word burst for reducing address bus frequency
Double Data Rate (DDR) interfaces on both read and write ports
(data transferred at 600 MHz) at 300 MHz
Two input clocks (K and K) for precise DDR timing
SRAM uses rising edges only
Two input clocks for output data (C and C) to minimize clock
skew and flight time mismatches
Echo clocks (CQ and CQ) simplify data capture in high speed
systems
Single multiplexed address input bus latches address inputs
for both read and write ports
Separate port selects for depth expansion
Synchronous internally self-timed writes
QDR-II operates with 1.5 cycle read latency when DLL is
enabled
Operates similar to a QDR-I device with 1 cycle read latency
in DLL off mode
Available in x 8, x 9, x 18, and x 36 configurations
Full data coherency, providing most current data
Core V
DD
= 1.8 (±0.1V); IO V
DDQ
= 1.4V to V
DD
Available in 165-ball FBGA package (15 x 17 x 1.4 mm)
Offered in both Pb-free and non Pb-free packages
Variable drive HSTL output buffers
JTAG 1149.1 compatible test access port
Delay Lock Loop (DLL) for accurate data placement
Configurations
CY7C1411JV18 – 4M x 8
CY7C1426JV18 – 4M x 9
CY7C1413JV18 – 2M x 18
CY7C1415JV18 – 1M x 36
Functional Description
The CY7C1411JV18, CY7C1426JV18, CY7C1413JV18, and
CY7C1415JV18 are 1.8V Synchronous Pipelined SRAMs,
equipped with QDR™-II architecture. QDR-II architecture
consists of two separate ports to access the memory array. The
read port has dedicated data outputs to support the read opera-
tions and the write port has dedicated data inputs to support the
write operations. QDR-II architecture has separate data inputs
and data outputs to completely eliminate the need to “turn
around” the data bus required with common IO devices. Access
to each port is through a common address bus. Addresses for
read and write addresses are latched on alternate rising edges
of the input (K) clock. Accesses to the QDR-II read and write
ports are completely independent of one another. To maximize
data throughput, read and write ports are equipped with DDR
interfaces. Each address location is associated with four 8-bit
words (CY7C1411JV18), 9-bit words (CY7C1426JV18), 18-bit
words (CY7C1413JV18), or 36-bit words (CY7C1415JV18) that
burst sequentially into or out of the device. Because data can be
transferred into and out of the device on every rising edge of both
input clocks (K and K
and C and C), memory bandwidth is
maximized while simplifying system design by eliminating bus
“turn arounds”.
Depth expansion is accomplished with port selects, which
enables each port to operate independently.
All synchronous inputs pass through input registers controlled by
the K or K
input clocks. All data outputs pass through output
registers controlled by the C or C
(or K or K in a single clock
domain) input clocks. Writes are conducted with on chip
synchronous self-timed write circuitry.
Selection Guide
300 MHz 250 MHz 200 MHz Unit
Maximum Operating Frequency 300 250 200 MHz
Maximum Operating Current x8 965 745 620 mA
x9 970 760 620
x18 1010 790 655
x36 1130 870 715
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Resumo do Conteúdo

Página 1 - Burst Architecture

36-Mbit QDR™-II SRAM 4-WordBurst ArchitectureCY7C1411JV18, CY7C1426JV18CY7C1413JV18, CY7C1415JV18Cypress Semiconductor Corporation • 198 Champion Cour

Página 2

CY7C1411JV18, CY7C1426JV18CY7C1413JV18, CY7C1415JV18Document Number: 001-12557 Rev. *C Page 10 of 28Truth TableThe truth table for CY7C1411JV18, CY7C1

Página 3

CY7C1411JV18, CY7C1426JV18CY7C1413JV18, CY7C1415JV18Document Number: 001-12557 Rev. *C Page 11 of 28Write Cycle DescriptionsThe write cycle descriptio

Página 4

CY7C1411JV18, CY7C1426JV18CY7C1413JV18, CY7C1415JV18Document Number: 001-12557 Rev. *C Page 12 of 28IEEE 1149.1 Serial Boundary Scan (JTAG)These SRAMs

Página 5

CY7C1411JV18, CY7C1426JV18CY7C1413JV18, CY7C1415JV18Document Number: 001-12557 Rev. *C Page 13 of 28IDCODEThe IDCODE instruction loads a vendor-specif

Página 6

CY7C1411JV18, CY7C1426JV18CY7C1413JV18, CY7C1415JV18Document Number: 001-12557 Rev. *C Page 14 of 28TAP Controller State DiagramThe state diagram for

Página 7

CY7C1411JV18, CY7C1426JV18CY7C1413JV18, CY7C1415JV18Document Number: 001-12557 Rev. *C Page 15 of 28TAP Controller Block DiagramTAP Electrical Charact

Página 8

CY7C1411JV18, CY7C1426JV18CY7C1413JV18, CY7C1415JV18Document Number: 001-12557 Rev. *C Page 16 of 28TAP AC Switching Characteristics Over the Operatin

Página 9

CY7C1411JV18, CY7C1426JV18CY7C1413JV18, CY7C1415JV18Document Number: 001-12557 Rev. *C Page 17 of 28Identification Register Definitions Instruction Fi

Página 10 - CY7C1413JV18, CY7C1415JV18

CY7C1411JV18, CY7C1426JV18CY7C1413JV18, CY7C1415JV18Document Number: 001-12557 Rev. *C Page 18 of 28Boundary Scan Order Bit # Bump ID Bit # Bump ID Bi

Página 11

CY7C1411JV18, CY7C1426JV18CY7C1413JV18, CY7C1415JV18Document Number: 001-12557 Rev. *C Page 19 of 28Power Up Sequence in QDR-II SRAMQDR-II SRAMs must

Página 12

CY7C1411JV18, CY7C1426JV18CY7C1413JV18, CY7C1415JV18Document Number: 001-12557 Rev. *C Page 2 of 28Logic Block Diagram (CY7C1411JV18)Logic Block Diagr

Página 13

CY7C1411JV18, CY7C1426JV18CY7C1413JV18, CY7C1415JV18Document Number: 001-12557 Rev. *C Page 20 of 28Maximum RatingsExceeding maximum ratings may impai

Página 14

CY7C1411JV18, CY7C1426JV18CY7C1413JV18, CY7C1415JV18Document Number: 001-12557 Rev. *C Page 21 of 28ISB1Automatic Power Down CurrentMax VDD, Both Port

Página 15

CY7C1411JV18, CY7C1426JV18CY7C1413JV18, CY7C1415JV18Document Number: 001-12557 Rev. *C Page 22 of 28CapacitanceTested initially and after any design o

Página 16 - [+] Feedback

CY7C1411JV18, CY7C1426JV18CY7C1413JV18, CY7C1415JV18Document Number: 001-12557 Rev. *C Page 23 of 28Switching CharacteristicsOver the Operating Range

Página 17

CY7C1411JV18, CY7C1426JV18CY7C1413JV18, CY7C1415JV18Document Number: 001-12557 Rev. *C Page 24 of 28Switching WaveformsFigure 5. Read/Write/Deselect

Página 18

CY7C1411JV18, CY7C1426JV18CY7C1413JV18, CY7C1415JV18Document Number: 001-12557 Rev. *C Page 25 of 28Ordering Information Not all of the speed, package

Página 19 - DLL Constraints

CY7C1411JV18, CY7C1426JV18CY7C1413JV18, CY7C1415JV18Document Number: 001-12557 Rev. *C Page 26 of 28200 CY7C1411JV18-200BZC 51-85195 165-Ball Fine Pit

Página 20 - Operating Range

CY7C1411JV18, CY7C1426JV18CY7C1413JV18, CY7C1415JV18Document Number: 001-12557 Rev. *C Page 27 of 28Package DiagramFigure 6. 165-Ball FBGA (15 x 17 x

Página 21

Document Number: 001-12557 Rev. *C Revised June 25, 2008 Page 28 of 28QDR RAMs and Quad Data Rate RAMs comprise a new family of products developed by

Página 22 - Capacitance

CY7C1411JV18, CY7C1426JV18CY7C1413JV18, CY7C1415JV18Document Number: 001-12557 Rev. *C Page 3 of 28Logic Block Diagram (CY7C1413JV18)Logic Block Diagr

Página 23

CY7C1411JV18, CY7C1426JV18CY7C1413JV18, CY7C1415JV18Document Number: 001-12557 Rev. *C Page 4 of 28Pin ConfigurationThe pin configuration for CY7C1411

Página 24 - Switching Waveforms

CY7C1411JV18, CY7C1426JV18CY7C1413JV18, CY7C1415JV18Document Number: 001-12557 Rev. *C Page 5 of 28CY7C1413JV18 (2M x 18)1 2 3 4 5 6 7 8 9 10 11A CQ N

Página 25

CY7C1411JV18, CY7C1426JV18CY7C1413JV18, CY7C1415JV18Document Number: 001-12557 Rev. *C Page 6 of 28Pin Definitions Pin Name IO Pin DescriptionD[x:0]In

Página 26

CY7C1411JV18, CY7C1426JV18CY7C1413JV18, CY7C1415JV18Document Number: 001-12557 Rev. *C Page 7 of 28CQ Echo Clock CQ is Referenced With Respect to C. T

Página 27 - Package Diagram

CY7C1411JV18, CY7C1426JV18CY7C1413JV18, CY7C1415JV18Document Number: 001-12557 Rev. *C Page 8 of 28Functional OverviewThe CY7C1411JV18, CY7C1426JV18,

Página 28 - Document History Page

CY7C1411JV18, CY7C1426JV18CY7C1413JV18, CY7C1415JV18Document Number: 001-12557 Rev. *C Page 9 of 28includes forwarding data from a write cycle that wa

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